NEW DELHI, October 13 — The Union Cabinet, chaired by the Prime Minister, on Tuesday approved a sanctioned fiscal support allocation of ₹3,114 crore under the ₹76,000 crore India Semiconductor Mission (ISM) for the greenfield Outsourced Semiconductor Assembly and Test (OSAT) facility being established by Tata Electronics in Morigaon, Assam.
According to the Ministry of Electronics and Information Technology (MeitY), the project involves an aggregate capital investment of ₹27,000 crore, establishing Northeast India's first high-tech semiconductor packaging complex. Designed with an ultimate daily production capacity of 48 million semiconductor chips, the facility will deploy indigenous advanced packaging architectures—including Flip Chip and Integrated System in Package (ISIP) technologies—catering to global automotive, electric vehicle, power electronics, and 5G communications OEMs.
MeitY officials emphasized that the facility will generate over 27,000 direct and indirect high-skilled engineering jobs in the Brahmaputra Valley, acting as an anchor industrial investment synergistic with the Uttar Poorva Transformative Industrialisation Scheme (UNNATI 2024).
The operational design of the India Semiconductor Mission (ISM launched in 2021 with 50% fiscal capital support), technical segmentation across the semiconductor value chain (front-end fabrication versus back-end ATMP/OSAT), wide-bandgap semiconductors (Silicon Carbide and Gallium Nitride), and regional industrial decentralisation under UNNATI 2024 are core topics across UPSC Civil Services (GS-III: Industrial Growth & Emerging Technologies) and State Engineering examinations.